![]() Such as increasing the wettability of QFN to eat tin. It can be used when the part or circuit board does not eat tin well. The MSTR series is PC controlled, with a friendly interface and many software functions. OSP surface treatment dual-sided reflow board is suitable to use nitrogen reflow oven. Choose from BTU Pyramax, Electrovert, Heller and other reflow ovens refurbished by Cardinal Circuits trained engineers. Reflow oven convection with 8-10-12 heating zones + cooling The MSTR series of reflow ovens, including the MSTR-800, MSTR-1000 and MSTR-1200, are forced thermal convection reflow soldering ovens, used to join electronic components to a PCB printed circuit. What kind of circuit boards or parts are suitable for nitrogen reflow? Increase the chance of tombstone generationĮnhance capillary phenomenon (wick effect) Because the oxidation of the solder paste or solder pad is reduced, the fluidity of the solder becomes better.ĭisadvantages of reflow soldering and nitrogen: If the surface of parts or circuit boards has been severely oxidized, nitrogen cannot bring them back to life, and nitrogen can only have a remedial effect on slight oxidation (remedy, not solution) Order) 1 YRS CN Supplier 1h response time Contact Supplier 1/6 Selling Greatly Convenient For Maintenance Reflow Oven Machine Kt10 Zones Smd Reflow Oven 22,000.00-25,000.00/ Set 1.0 Sets (Min. Nitrogen is not a panacea for PCB oxidation. Hot air cheap SMT Reflow oven 6 zones HC-R612 used reflow oven profiler for pcb mounting machine 2,700.00-2,800.00/ Set 1 Set (Min. Secondly, nitrogen reduces the concentration of the original oxygen abd the substances which will contaminate the soldering surface, this kind of function can greatly reduces the oxidation effect of high-temperature soldering, especially in the improvement of the quality of the second side reflow. Because nitrogen is a kind of inert gas, it is not easy to produce compounds with metals, and it can also isolate oxygen and metals in the airto prevent oxidation reaction from happening.įirstly, the principle of using nitrogen to improve the solderability of SMT is based on the fact that the surface tension of solder under a nitrogen environment will be lower than when exposed to the atmosphere, so that the fluidity and wettability of the solder are increased. ![]() The main purpose of adding nitrogen (N2) to the SMT reflow oven is to reduce the oxidation of the welding surface and improve the wettability of the welding.
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